Composite heatpipes are tuned for each individual cooling design with optimal heat flow efficiently and evenly distributing heat throughout the cooling module Angled velocity provides a double layer of downward air pressure that when with the air pressure on the outer ring of the axial fan results in up to 44 more downward air pressure and up to 19 more airflow for quieter cooler operation when compared to previous generations To protect your board SAPPHIRE boards feature fuse protection built into the external PCIE power connector circuit to keep components secure
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